Datasheet · 2024

ST VL53L1X Long-Distance Time-of-Flight Ranging Sensor — Datasheet (DS12385 Rev 8)

Time-of-flight ranging limits, considered and rejected for aiming.

Author: STMicroelectronics
Year: 2024
Type: Datasheet
Credit: STMicroelectronics (st.com)

time of flight
spad
ranging

VL53L1X Datasheet A new generation, long distance ranging Time-of-Flight sensor based on ST's FlightSense technology Features Fully integrated miniature module • • • • 940 nm invisible laser emitter (Class 1) SPAD (single photon avalanche diode) receiving array with integrated lens Low power microcontroller running advanced digital firmware 4.9 x 2.5 x 1.56 mm Fast, accurate distance ranging • Product status link VL53L1X • • • • Fast and accurate long distance ranging – Up to 400 cm distance measurement – Up to 50 Hz ranging frequency Pin-to-pin compatible with the VL53L0X FlightSense ranging sensor 27° typical full field of view (FoV) Programmable region of interest (ROI) size on the receiving array allows reduction of the sensor FoV A programmable ROI position on the receiving array, provides multizone operation control from the host Eye safety • Class 1 laser device compliant with latest standard IEC 60825-1:2014 - 3rd edition Easy integration • • • • • • Software driver and code example for turnkey ranging Single reflowable component Single power supply 2v8 Can be hidden behind many cover glass materials I²C interface (up to 400 kHz) Shutdown and interrupt pins Application • • • • • • • • User detection (autonomous low-power mode) to power on/off and lock/unlock devices like personal computers/laptops and the Internet of Things (IoT) Service robots and vacuum cleaners (long distance and fast obstacle detection) Drones (landing assistance, hovering, ceiling detection) Smart shelves and vending machines (goods inventory monitoring) Sanitary (robust user detection whatever the target reflectance) Smart building and smart lighting (people detection, gesture control) 1 D gesture recognition Laser assisted autofocus (AF) enhances the camera AF system's speed and robustness, especially in difficult scenes such as low light and low contrast, and provides video focus tracking assistance DS12385 - Rev 8 - August 2024 For further information contact your local STMicroelectronics sales office. www.st.com VL53L1X Description The VL53L1X is a state-of-the-art, Time-of-Flight (ToF) laser-ranging sensor, enhancing the ST FlightSense product family. It is the fastest miniature ToF sensor on the market with accurate ranging up to 4 m and fast ranging frequency up to 50 Hz. Housed in a miniature and reflowable package, it integrates a SPAD receiving array, a 940 nm invisible Class 1 laser emitter, physical infrared filters, and optics to achieve the best ranging performance in various ambient lighting conditions with a range of cover glass options. Unlike conventional IR sensors, the VL53L1X uses ST’s latest generation ToF technology, which allows absolute distance measurement whatever the target color and reflectance. It is also possible to program the size of the ROI on the receiving array, allowing the sensor FoV to be reduced. DS12385 - Rev 8 page 2/36 VL53L1X Acronyms and abbreviations 1 Acronyms and abbreviations Table 1. Acronyms and abbreviations DS12385 - Rev 8 Acronym/abbreviation Definition AMR absolute maximum rating API application programming interface ESD electrostatic discharge FoV field of view HW STANDBY hardware standby I²C inter-integrated circuit (serial bus) MSB most significant bit PCB printed circuit board ROI region of interest SCL serial clock line SDA serial data line SW STANDBY software standby SPAD single photon avalanche diode TB timing budget ToF Time-of-Flight VCSEL vertical-cavity surface-emitting laser page 3/36 VL53L1X Product overview 2 Product overview 2.1 Technical specification Table 2. Technical specification Feature Detail Package Optical LGA12 Size 4.4 x 2.5 x 1.56 mm Operating voltage 2.6 to 3.5 V Operating temperature -20 to 85°C Receiver FoV (diagonal FoV) Programmable from 15 to 27 degrees Infrared emitter 940 nm Up to 400 kHz (fast mode) serial bus I²C 2.2 Programmable address default is 0x52 System block diagram Figure 1. VL53L1X block diagram VL53L1X module VL53L1X silicon GND SDA Single Photon Avalanche Diode (SPAD) Detection array AVDD ROM XSHUT Non Volatile Memory SCL RAM GPIO1 Microcontroller Advanced Ranging Core VCSEL Driver AVSSVCSEL IR+ IR- AVDDVCSEL 940nm DS12385 - Rev 8 page 4/36 VL53L1X Product overview 2.3 Device pinout The following figure shows the pinout of the VL53L1X (see also Section 8: Outline drawings). Figure 2. VL53L1X pinout (bottom view) GND3 GPIO1 7 DNC 6 5 XSHUT 8 4 GND2 SDA 9 3 GND SCL 10 2 AVSSVCSEL AVDD 11 1 AVDDVCSEL 12 GND4 Table 3. VL53L1X pin description Pin number Signal name Signal type Signal description 1 AVDDVCSEL Supply VCSEL supply, connect to main supply 2 AVSSVCSEL 3 GND 4 GND2 5 XSHUT Digital input Xshutdown pin, active low 6 GND3 Ground Connect to the main ground 7 GPIO1 Digital output Interrupt output. Open drain output 8 DNC Digital input Do not connect, must be left floating 9 SDA Digital input/output I²C serial data 10 SCL Digital input I²C serial clock input 11 AVDD Supply Supply, connect to the main supply 12 GND4 Ground Connect to the main ground VCSEL ground, connect to main ground Ground Connect to the main ground Note: AVSSVCSEL and GND are ground pins and can be connected together in the application schematics. Note: GND2, GND3, and GND4 are standard pins that we force to the ground domain in the application schematics to avoid possible instabilities if set to other states. DS12385 - Rev 8 page 5/36 VL53L1X Product overview 2.4 Application schematic The following figure shows the application schematic of the VL53L1X. Figure 3. VL53L1X schematic IOVDD AVDD 5 7 HOST 9 10 8 XSHUT AVDDVCSEL GPIO1 AVDD SDA AVSSVCSEL SCL GND DNC GND2 GND3 VL53L1X GND4 1 11 2 3 100nF Capacitors as close as 4.7µF possible to VL53L1X 4 6 12 Note: Place the capacitors on the external supply AVDD as close as possible to the AVDDVCSEL and AVSSVCSEL module pins. Note: The external pull-up resistor values can be found in the I²C-bus specification. Pull-ups are typically fitted only once per bus, near the host. See Table 4. Suggested pull-up and series resistors for I2C fast mode for suggested values. Note: The XSHUT pin must always be driven to avoid leakage current. A pull-up is needed if the host state is not known. XSHUT is needed to use hardware standby mode (there is no I²C communication). Note: The recommended value of the XSHUT and GPIO1 pull-ups is 10 kOhms. Note: Leave the GPIO1 unconnected if not used. Table 4 shows the recommended values for pull-up resistors for an AVDD of 1.8 V to 2.8 V in I2C fast mode (up to 400 kHz). Table 4. Suggested pull-up and series resistors for I2C fast mode I2C load capacitance (CL) (1) Pull-up resistor (Ohms) CL ≤ 90 pF 3.6 k 90 pF < CL ≤ 140 pF 2.4 k 140 pF < CL ≤ 270 pF 1.2 k 270 pF < CL ≤ 400 pF 0.8 k 1. For each bus line, CL is measured in the application PCB by the customer. DS12385 - Rev 8 page 6/36 VL53L1X Functional description 3 Functional description 3.1 System functional description Figure 4. VL53L1X system functional description shows the system level functional description. The host customer application controls the VL53L1X device using an API (application programming interface). The API implementation is delivered to the customer as a driver (Bare C code). The driver shares with the customer application a set of high level functions that allow control of the VL53L1X firmware. Functions include initialization, ranging start/stop, and setting the system accuracy. The driver enables fast development of end user applications without the complication of direct multiple register access. The driver is structured in a way that it can be compiled on any kind of platform through a good hardware abstraction layer. A detailed description of the driver is available in the VL53L1X API user manual(UM2356). Figure 4. VL53L1X system functional description HOST User Application DS12385 - Rev 8 VL53L1X driver VL53L1X I2C page 7/36 VL53L1X Functional description 3.2 System state machine description The following figure shows the system state machine. Figure 5. System state machine DS12385 - Rev 8 page 8/36 VL53L1X Functional description 3.3 Customer manufacturing calibration flow The VL53L1X driver includes calibration functions. To benefit from device full performances, it is recommended they be run once at the customer production line. Device calibration allows for the compensation of part-to-part parameter variations and the presence of a cover glass that may affect device performance. Calibration data stored in the host have to be loaded into the VL53L1X at each startup using a dedicated driver function. Three calibration steps are needed: RefSPAD, offset, and crosstalk. RefSPAD and crosstalk calibrations have to be performed whenever the customer adds a protective cover glass on top of the VL53L1X module. Offset calibration has to be performed in all situations. It allows reflow and cover glass effects to be compensated. The detailed procedure is provided in the VL53L1X API user manual (UM2356). 3.4 Ranging description The VL53L1X software driver proposes a turnkey solution to allow fast implementation and easy ranging in all customer applications. Autonomous ranging mode is the default configuration that offers optimized functionalities of the VL53L1X. • • • • Ranging is continuous, with a programmable delay between two ranging operations (called an intermeasurement period). The ranging duration (timing budget) is also programmable. The user can set distance thresholds (below, above, inside, or outside the user-defined thresholds). An interrupt is raised only when threshold conditions are met. ROI size and position are programmable. The user chooses a custom FoV from 4x4 SPADs (minimum size) up to 16x16 SPADs (full FoV). A clear interrupt is mandatory to allow the next ranging data to be updated. If the ranging distance cannot be measured (when there is no target or a weak signal), a corresponding range status is generated. The host can read the range status. The VL53L1X software driver provides turnkey functions to read output results after the measurement. The main values reported are: • • • • Ranging distance in mm Return signal rate Ambient signal rate Range status Range status and output measurement definitions are provided in the VL53L1X API user manual (UM2356). 3.5 3.5.1 Key parameters Distance mode The VL53L1X has three distance modes (DM): short, medium, and long. Long distance mode allows the longest possible ranging distance of 4 m to be reached. However, this maximum ranging distance is impacted by ambient light. Short distance mode is more immune to ambient light, but its maximum ranging distance is typically limited to 1.3 m. Table 5. Maximum distance vs. distance mode under ambient light DS12385 - Rev 8 Distance mode Max. distance in the dark (cm) Max. distance under strong ambient light (cm) Short 136 135 Medium 290 76 Long 360 73 page 9/36 VL53L1X Functional description Test conditions Timing budget (TB) = 100 ms, white target 88%, dark = no IR ambient, and ambient light = 200 kcps/SPAD 3.5.2 Timing budget The VL53L1X timing budget can be set from 20 ms up to 1000 ms. • • • 20 ms is the minimum timing budget and can be used only in short distance mode. 33 ms is the minimum timing budget which can work for all distance modes. 140 ms is the timing budget which allows the maximum distance of 4 m (in the dark on a white chart) to be reached with long distance mode Increasing the timing budget increases the maximum distance the device can range and improves the repeatability error. However, average power consumption augments accordingly. Figure 6. Maximum distance and repeatability error vs. timing budget Test conditions Timing budget = 33 ms, 40 ms, 200 ms, grey target 54%, ambient light = dark DS12385 - Rev 8 page 10/36 VL53L1X Functional description 3.6 Power up and boot sequence Two options are available for device power-up/boot. Option 1 The XSHUT pin is connected and controlled from the host. This option optimizes power consumption. The device can be completely powered off when not used, and then woken up through the host GPIO (using the XSHUT pin). Hardware standby mode is the period when the power supply is present and the XSHUT is low. Figure 7. Power-up and boot sequence Note: The boot duration is 1.2 ms maximum. Option 2 The host does not control the XSHUT pin. This pin is tied to the power supply value through a pull-up resistor. When the XSHUT pin is not controlled, the power-up sequence is as shown in the following figure. In this case, the device goes automatically to software standby after boot, without entering hardware standby. Figure 8. Power-up and boot sequence with XSHUT not controlled Note: The boot duration is 1.2 ms maximum. Note: In all cases, XSHUT has to be raised only when the power supply is tied on. DS12385 - Rev 8 page 11/36 VL53L1X Functional description 3.7 Ranging sequences The following figure shows the combination of the driver commands and the system states. Figure 9. Autonomous sequence Note: 3.8 The user sets the timing budget and inter measurement timing parameters using a dedicated driver function. Sensing array optical center The VL53L1X module includes a lens that focuses the photons on the 16x16 SPAD-sensing array. The sensing array optical center specification considers the part-to-part variation in production. The optical center is defined by the coordinates Xo and Yo. The optical center is measured for each part during a factory test at STMicroelectronics. The coordinates are stored in the VL53L1X nonvolatile memory and are readable by the customer through the software driver in the application. This helps optimize design alignment with the image sensor in the application and its ranging performance. The green array in Figure 10. Optical center specification gives the possible location of the optical center. For more details, refer to the VL53L1X API user manual (UM2356). Table 6. Optical center specification Parameter Min. Typ. Max. Xo offset -2 0 2 Yo offset -2 0 2 Unit SPAD Figure 10. Optical center specification 2, -2 DS12385 - Rev 8 page 12/36 VL53L1X Control interface 4 Control interface This section specifies the control interface. The I²C interface uses two signals: serial data line (SDA) and serial clock line (SCL). Each device connected to the bus uses a unique address and a simple controller/target relationship exists. Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host. Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull lines up. When no data are transmitted both lines are high. Clock signal generation is performed by the controller device. The controller device initiates data transfer. The I²C bus on the VL53L1X has a maximum speed of 400 kbits/s and uses a default device address of 0x52. Figure 11. Data transfer protocol Acknowledge Start condition SDA MSB SCL S LSB 1 3 2 4 5 8 7 6 Address or data byte Ac/Am P Stop condition Information is packed in 8-bit packets (bytes) and is always followed by an acknowledge bit, Ac for the VL53L1X acknowledge and Am for the controller acknowledge (host bus controller). The internal data are produced by sampling SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The exceptions to this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high. A message contains a series of bytes preceded by a start condition, and followed by either a stop or repeated start (another start condition but without a preceding stop condition), followed by another message. The first byte contains the device address (0x52) and also specifies the data direction. If the least significant bit is low (that is, 0x52) the message is a controller write-to-the-target. If the LSB is set (that is, 0x53) then the message is a controller read-from-the-target. Figure 12. I²C device address: 0x52 LSBit MSBit 0 1 0 1 0 0 1 R/W All serial interface communications with the ToF sensor must begin with a start condition. The VL53L1X module acknowledges the receipt of a valid address by driving the SDA wire low. The state of the read/write bit (LSB of the address byte) is stored and the next byte of data, sampled from SDA, can be interpreted. During a write sequence, the second byte received provides a 16-bit index, which points to one of the internal 8-bit registers. DS12385 - Rev 8 page 13/36 VL53L1X Control interface Figure 13. Data format (write) Start S VL53L1X acknowledges valid address ADDRESS[7:0] As Acknowledge from VL53L1X INDEX[15:8] As INDEX[7:0] As As P DATA[7:0] 0x52 (write) Stop As data are received by the target, they are written bit by bit to a serial/parallel register. After each data byte has been received by the target, an acknowledge is generated, the data are then stored in the internal register addressed by the current index. During a read message, the contents of the register addressed by the current index is read out in the byte following the device address byte. The contents of this register are parallel loaded into the serial/parallel register and clocked out of the device by the falling edge of SCL. Figure 14. Data format (read) 0x52 (write) S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P 0x53 (read) S ADDRESS[7:0] As DATA[7:0] Am P At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving device (that is, the VL53L1X for a write, and the host for a read). A message can only be terminated by the bus controller, either by issuing a stop condition or by a negative acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation. The interface also supports auto increment indexing. After the first data byte has been transferred, the index is automatically incremented by 1. The controller can therefore send data bytes continuously to the target until the target fails to provide an acknowledge, or the controller terminates the write communication with a stop condition. If the auto increment feature is used, the controller does not have to send address indexes to accompany the data bytes. Figure 15. Data format (sequential write) DS12385 - Rev 8 page 14/36 VL53L1X Control interface Figure 16. Data format (sequential read) 0x52 (write) ADDRESS[7:0] S INDEX[15:8] As INDEX[7:0] As As P 0x53 (read) S ADDRESS[7:0] DATA[7:0] 4.1 DATA[7:0] As Am DATA[7:0] DATA[7:0] Am Am DATA[7:0] Am Am P I²C interface - timing characteristics Timing characteristics are shown in the Table 7. I²C interface - timing characteristics for fast mode (400 kHz). Refer to Figure 17. I²C timing characteristics for an explanation of the parameters used. Table 7. I²C interface - timing characteristics for fast mode (400 kHz) DS12385 - Rev 8 Symbol Parameter Minimum Typical Maximum Unit FI2C Operating frequency 0 — 400 kHz tLOW Clock pulse width low 1.3 — — tHIGH Clock pulse width high 0.6 — — tSP Pulse width of spikes that are suppressed by the input filter — — 50 ns tBUF Bus free time between transmissions 1.3 — — µs tHD.STA Start hold time 0.26 — — tSU.STA Start setup time 0.26 — — tHD.DAT Data in hold time 0 — 0.9 tSU.DAT Data in setup time 50 — — tR SCL/SDA rise time — — 300 tF SCL/SDA fall time — — 300 tSU.STO Stop setup time 0.6 — — Ci/o Input/output capacitance (SDA) — — 10 Cin Input capacitance (SCL) — — 4 CL Load capacitance — 125 400 μs μs ns μs pF page 15/36 VL53L1X Control interface Figure 17. I²C timing characteristics stop start start ... SDA tBUF SCL tLOW tR stop VIH VIL tHD.STA tF VIH ... VIL tHD.STA tHD.DAT tHIGH tSU.DAT tSU.STA tSU.STO All timings are measured from either VIL or VIH. 4.2 I²C interface - reference registers The registers shown in the table below can be used to validate the user I²C interface. Table 8. Reference registers Note: Register name Index After fresh reset, without the driver loaded Model ID 0x010F 0xEA Module type 0x0110 0xCC Mask revision 0x0111 0x10 The I²C read/writes can be 8, 16, or 32-bit. Multibyte read/writes are always addressed in ascending order with the MSB first as shown in Table 9. 32-bit register example. The customer must use the VL53L1X software driver for easy and efficient ranging operations to match performance and accuracy criteria. Hence full register details are not exposed. The customer should refer to the VL53L1X API user manual (UM2356). Table 9. 32-bit register example DS12385 - Rev 8 Register address Byte Address MSB Address + 1 ... Address + 2 ... Address + 3 LSB page 16/36 VL53L1X Thermal characteristics 5 Thermal characteristics 5.1 Absolute maximum rating (TSTG) Warning: Stresses above those listed in the following table may cause permanent damage to the device. These are stress ratings only. Functional operation of the device is not implied at these or any other conditions above those indicated in the operational sections of the specification. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The storage temperature (TSTG) is the ambient temperature at which the device can be stored with no voltage applied. Table 10. Absolute maximum rating conditions 5.2 Parameter Min. Max. Unit Storage temperature (TSTG) -40 105 °C Ambient operating temperature The ambient operating temperature is the temperature at which the device may be powered and can operate without any damage. Table 11. Recommended operating temperature DS12385 - Rev 8 Parameter Min. Max. Unit Ambient operating temperature -20 85 °C page 17/36 VL53L1X Electrical characteristics 6 Electrical characteristics 6.1 Absolute maximum ratings Warning: Stresses above those listed in the following table may cause permanent damage to the device. These are stress ratings only. Functional operation of the device is not implied at these or any other conditions above those indicated in the operational sections of the specification. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 12. Absolute maximum ratings Parameter AVDD SCL, SDA, XSHUT, and GPIO1 6.2 Min. Typ. Max. Unit -0.5 — 3.6 V Recommended operating conditions Table 13. Recommended operating conditions There are no power supply sequencing requirements. The I/Os may be high, low, or floating when AVDD is applied. The I/Os are internally failsafe with no diode connecting them to AVDD. Parameter Min. Typ. Max. Voltage (AVDD) 2.6 2.8 3.5 Standard mode 1.6 1.8 1.9 2V8 mode (2) (3) 2.6 2.8 3.5 IO (IOVDD) (1) Unit V 1. XSHUT should be high only when AVDD is on. 2. SDA, SCL, XSHUT, and GPIO1 high levels have to be equal to AVDD in 2V8 mode. 3. The default driver mode is 1V8. 2V8 mode is programmable using the device settings loaded by the driver. For more details, refer to the VL53L1X API user manual (UM2356). 6.3 Electrostatic discharge The VL53L1X is compliant with the ESD values presented in the following table. Table 14. ESD performances DS12385 - Rev 8 Parameter Specification Conditions Human body model JS-001-2012 ± 2 kV, 1500 ohms, 100 pF Charged device model JESD22-C101 ± 500 V page 18/36 VL53L1X Electrical characteristics 6.4 Current consumption Table 15. Power consumption at ambient temperature All current consumption values include silicon process variations. Temperature and voltage are nominal conditions (23°C and 2.8 V). All values include AVDD and AVDDVCSEL. Parameter Min. Typ. Max. HW STANDBY 3 5 7 SW STANDBY (2V8 mode) (1) 4 6 9 Inter measurement — 20 — Ranging average (AVDD + AVDDVCSEL) (2) (3) — 16 18 Average power consumption at 10 Hz with 33 ms timing budget — — 20 Average power consumption at 1 Hz with 20 ms timing budget when no target is detected — 0.9 — Average power consumption at 1 Hz with 20 ms timing budget when the target is detected — 1.4 — Unit μA mA mW 1. In 2V8 (IOVDD) mode, pull-ups have to be modified. Then the SW STANDBY consumption is increased by 0.6 µA. 2. Average consumption during the ranging operation in long distance mode. 3. Peak current (including VCSEL) can reach 40 mA. 6.5 Digital input and output Table 16. Digital I/O electrical characteristics Symbol Parameter Min. Typ. Max. Unit Interrupt pin (GPIO1) VIL Low level input voltage — 0.3 IOVDD VIH High level input voltage 0.7 IOVDD — VOL Low level output voltage (IOUT = 4 mA) — VOH High level output voltage (IOUT = 4 mA) IOVDD-0.4 — FGPIO Operating frequency (CLOAD = 20 pF) 0 108 — 0.4 V MHz I²C interface (SDA/SCL) VIL Low level input voltage -0.5 0.6 VIH High level input voltage 1.12 3.5 VOL Low level output voltage (IOUT = 4 mA) — Leakage current (1) — 10 Leakage current (2) — 0.15 IIL/IH — V 0.4 μA 1. AVDD = 0 V 2. AVDD = 2.85 V, and I/O voltage = 1.8 V DS12385 - Rev 8 page 19/36 VL53L1X Ranging performance 7 Ranging performance 7.1 Test conditions In all the measurement tables of this document, it is considered that: 1. The full FoV is covered (typically at 27°). Alternatively, a partial FoV is covered after a specific ROI definition by the user. The array size of the partial FoV is from 4x4 SPADs to 16x16 SPADs. 2. The charts used as targets are: – Gray with a reflectance of 17% and a Munsell of N4.74. – Gray with a reflectance of 54% and a Munsell of N8.25. – White with a reflectance of 88% and a Munsell of N9.5. 3. The nominal voltage is 2.8 V and the temperature is 23°C. 4. The detection rate is considered as 100%. 5. Unless mentioned, the device is controlled through the driver using the following default settings: – Distance mode is long. – Timing budget is 100 ms. – No cover glass is present. – Target covers the full FoV. 6. Ambient light is defined as follows: – – – – Note: DS12385 - Rev 8 Dark = no IR light in the band 940 nm ±30 nm. 50 kcps/SPAD = lighting on a sunny day from behind a window. 200 kcps/SPAD = lighting on a sunny day from behind a window, with direct illumination on the sensorNo cover glass is present. For reference, usual office lighting is around 5 kcps/SPAD. kcps is kilo counts per second. kcps/SPAD is the return ambient rate measured by the VL53L1X. page 20/36 VL53L1X Ranging performance 7.2 Accuracy, repeatability, and ranging error definitions 7.2.1 Accuracy definition Accuracy = mean distance–actual distance • • The mean distance is the average of 32 measured distances. The actual distance is the actual target distance. An offset error, a temperature drift, or a voltage drift may affect the accuracy. 7.2.2 Repeatability definition Repeatability is the standard deviation of the mean ranging value of 32 measurements. It can be improved by increasing the timing budget. A typical repeatability value for the VL53L1X ranges from ±1% to ±0.15% depending on the timing budget and the ambient light. 7.2.3 Ranging error definition Ranging error = accuracy + repeatability error. The ranging error value is an ST metric that is used in the performances tables below. 7.3 Minimum ranging distance The minimum ranging distance ensured is 4 cm. Under this minimum distance, the sensor detects a target, but the measurement is not accurate. 7.4 Performance in dark conditions Table 17. Performance in dark conditions Parameter Max. distance (cm) Ranging error (mm) Target reflectance Min. value Typ. value White 88% 260 360 (1) Gray 54% 220 340 Gray 17% 80 170 — ± 20 1. The typical value is 400 with a timing budget of 140 ms. Test conditions (including those described in Section 7.1: Test conditions) are: • • • DS12385 - Rev 8 Ambient light = dark Timing budget = 100 ms unless state otherwise Long distance mode page 21/36 VL53L1X Ranging performance 7.5 Performance in ambient light conditions 7.5.1 Long distance mode Table 18. Typical performance in ambient light with long distance mode Parameter Max. distance (cm) Ranging error (mm) Target reflectance Dark 50 kcps/SPAD 200 kcps/SPAD White 88% 360 166 73 Gray 54% 340 154 69 Gray 17% 170 114 68 — ± 20 ± 25 ± 25 Test conditions (including those described in Section 7.1: Test conditions) are: • • 7.5.2 Ambient light = dark, 50 kcps/SPAD, or 200 kcps/SPAD. Distance mode = long Short distance mode Table 19. Typical performance in ambient light with short distance mode Parameter Target reflectance Dark 200 kcps/SPAD White 88% 130 130 Gray 54% 130 130 Gray 17% 130 120 — ± 20 ± 25 Max. distance (cm) Ranging error (mm) Test conditions (including those described in Section 7.1: Test conditions) are: • • 7.6 Ambient light = dark, 200 kcps/SPAD. Distance mode = short Performance under partial ROI in dark conditions Table 20. Typical performance under partial ROI in dark conditions Parameter Target reflectance 16x16 8x8 4x4 White 88% 360 308 170 Gray 54% 340 254 143 Gray 17% 170 119 45 Diagnol FoV (degrees) — 27 20 15 Ranging error (mm) — ± 20 ± 20 ± 20 Max. distance (cm) Test conditions (including those described in Section 7.1: Test conditions) are: • • • • DS12385 - Rev 8 Ambient light = dark Target covers a partial FoV ROI is centered on the optical center Distance mode = long page 22/36 VL53L1X Outline drawings 8 Outline drawings Figure 18. Outline drawing (1/3) DS12385 - Rev 8 page 23/36 VL53L1X Outline drawings Figure 19. Outline drawing (2/3) DS12385 - Rev 8 page 24/36 VL53L1X Outline drawings Figure 20. Outline drawing (3/3) Caution: DS12385 - Rev 8 The VL53L1X module is delivered with a protective liner covering the top of the cap to protect the sensor from foreign material during the assembly process. It must be removed by the customer just before mounting the cover glass. page 25/36 VL53L1X Laser safety 9 Laser safety This product contains a laser emitter and corresponding drive circuitry. The laser output is designed to meet Class 1 laser safety limits under all reasonably foreseeable conditions including single faults in compliance with IEC 60825-1:2014. Do not increase the laser output power by any means. Do not use any optics to focus the laser beam. Caution: Use of controls or adjustments, or performance of procedures other than those specified herein may result in hazardous radiation exposure. Figure 21. Class 1 laser label This product complies with: • • • • DS12385 - Rev 8 IEC 60825-1:2014 21 CFR 1040.10 and 1040.11, except for conformance with IEC 60825-1:2014 as described in the laser notice number 56, dated May 8, 2019. EN 60825-1:2014 including EN 60825-1:2014/A11:2021 EN 50689:2021, however STMicroelectronics does not guarantee compliance with the requirement of clause 5 from EN50689 regarding child appealing products. If designing a child appealing product, contact STMicroelectronics' technical application support. page 26/36 VL53L1X Packing and labeling 10 Packing and labeling 10.1 Product marking A two line product marking is applied on the backside of the module (on the substrate). The first line is the silicon product code, and the second line, the internal tracking code. 10.2 Inner box labeling The labeling follows the STMicroelectronics' standard packing acceptance specification. The following information is on the inner box label: • • • • • • 10.3 Assembly site Sales type Quantity Trace code Marking Bulk ID number Packing At the customer/subcontractor level, it is recommended to mount the device in a clean environment to avoid foreign material deposition. To help avoid any foreign material contamination at product assembly level the modules are shipped in a tape and reel format with a protective liner, starting from production version (cut1.1). The packing is vacuum-sealed and includes a desiccant. DS12385 - Rev 8 page 27/36 VL53L1X Packing and labeling 10.4 Tape outline drawing Figure 22. Tape outline drawing DS12385 - Rev 8 page 28/36 VL53L1X Handling, moisture, and reflow precautions 11 Handling, moisture, and reflow precautions 11.1 Shock precaution Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject to excessive shock, it must be rejected even if no apparent damage is visible. For example, if it is dropped on the floor, or if a tray/reel of units is dropped on the floor. 11.2 Part handling Handling must be done with nonmarring, ESD, safe carbon, plastic, or Teflon™ tweezers. Ranging modules are susceptible to damage or contamination. The customer is advised to use a clean assembly process after removing the tape from the parts, and until a protective cover glass is mounted. 11.3 Compression force A maximum compressive load of 25 N should be applied on the module. 11.4 Moisture sensitivity level Moisture sensitivity is level 3 (MSL) as described in JEDEC JSTD-020-C. For devices that are classified to the levels defined in JEDEC JSTD-020-C, JEDEC JSTD-033-C provides: • • DS12385 - Rev 8 Manufacturers and users with standardized methods for handling, packing, and shipping. Standardized methods for using moisture/reflow and process sensitive devices. page 29/36 VL53L1X Handling, moisture, and reflow precautions 11.5 Pb-free solder reflow process Table 21. Recommended solder profile and Figure 23. Solder profile show the recommended and maximum values for the solder profile. Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect customers to follow the recommended reflow profile, which is specifically tuned for the VL53L1X package. If a customer must perform a reflow profile, which is different from the recommended one, the new profile must be qualified by the customer at their own risk. This is especially true for peaks >240°C. In any case, the profile must be within the “maximum” profile limit described in JEDEC JSTD-020-C and in Table 21. Recommended solder profile. Note: Temperatures mentioned in the table below are measured at the top of the VL53L1X package. Table 21. Recommended solder profile Parameters Recommended Maximum Minimum temperature (TS min) 130 150 Maximum temperature (TS max) 200 200 Time ts (TS min to TS max) 90-110 60-120 s Temperature (TL) 217 217 °C Time (tL) 55-65 55-65 s Ramp up 2 3 °C/s 250 °C 10 s 3 °C/s Temperature (Tp-10) Time (tp) — Ramp up Unit °C Peak temperature (Tp) 240 245 °C Time to peak 300 300 s Ramp down (peak to TL) -4 -6 °C/s Figure 23. Solder profile Note: The component should be limited to a maximum of three passes through this solder profile. Note: As the VL53L1X package is not sealed, only a dry reflow process should be used (such as convection reflow). Vapor phase reflow is not suitable for this type of optical component. Note: The VL53L1X is an optical component and should be treated carefully. This would typically include using a ‘nowash’ assembly process. DS12385 - Rev 8 page 30/36 VL53L1X Package information 12 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS12385 - Rev 8 page 31/36 VL53L1X Ordering information 13 Ordering information Table 22. Order codes DS12385 - Rev 8 Order codes Package Packing Minimum order quantity VL53L1CXV0FY/1 Optical LGA12 with liner Tape and reel 3600 pcs page 32/36 VL53L1X Ordering information Revision history Table 23. Document revision history Date Version 24-Jun-2022 6 29-Nov-2022 7 Changes Removed "™" from the document title. Updated Figure 15. Data format (sequential write) Updated Figure 18. Outline drawing (1/3), Figure 19. Outline drawing (2/3), and Figure 20. Outline drawing (3/3). Updated Figure 22. Tape outline drawing. Features section: Added "eye safety". Updated master/slave to controller/target. Added Section 5: Thermal characteristics, including a maximum AMR of 105°C. 09-Aug-2024 8 Table 13. Recommended operating conditions: Removed ambient temperature data. Section 6.5: Digital input and output: Updated maximum value of VIH to 3.5 V. Updated Section 9: Laser safety. Updated Section 10: Packing and labeling. Added Section 11: Handling, moisture, and reflow precautions. DS12385 - Rev 8 page 33/36 VL53L1X Contents Contents 1 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3 4 5 6 7 2.1 Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.3 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.4 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 System state machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3 Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4 Ranging description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.5 Key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.5.1 Distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.5.2 Timing budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.6 Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.7 Ranging sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.8 Sensing array optical center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Control interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 4.1 I²C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2 I²C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Thermal characteristics . . . . .