Datasheet · 2018

TI TUSB321 USB Type-C Configuration Channel Logic and Port Control — Datasheet (SLLSEO6C)

Type-C CC logic; source for the Type-C current-advertisement levels.

Author: Texas Instruments
Year: 2018
Type: Datasheet
Credit: Texas Instruments (ti.com)

usb type-c
cc logic
current advertisement

Order Now Product Folder Technical Documents Support & Community Tools & Software TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 TUSB321 USB Type-C™ Configuration Channel Logic and Port Control with VCONN 1 Features 3 Description • • The TUSB321 device enables USB Type-C ports with the configuration channel (CC) logic needed for TypeC ecosystems. The TUSB321 device uses the CC pins to determine port attach and detach, cable orientation, role detection, and port control for Type-C current mode. The TUSB321 device can be configured as a downstream facing port (DFP), upstream facing port (UFP) or a dual role port (DRP) making it ideal for any application. 1 • • • • • • • • USB Type-C™ Specification 1.1 Backward Compatible with USB Type-C Specification 1.0 Supports Up to 3 A of Current Advertisement through dedicated Current Mode pin Mode Configuration – Host Only – DFP (Source) – Device Only – UFP (Sink) – Dual Role Port – DRP Channel Configuration (CC) – Attach of USB Port Detection – Cable Orientation Detection – Role Detection – Type-C Current Mode advertisement and detection (Default, Medium, High) VBUS Detection VCONN Support for Active Cables Cable Detection and Direction Control for External Switches Supply Voltage: 4.5 V to 5.5 V Low Current Consumption The TUSB321 device when configured as a DRP alternates configuration as a DFP or UFP according to the Type-C Specifications. The CC logic block monitors the CC1 and CC2 pins for pullup or pulldown resistances to determine when a USB port has been attached, the orientation of the cable, and the role detected. The CC logic detects the Type-C current mode as default, medium, or high depending on the role detected. VBUS detection is implemented to determine a successful attach in UFP and DRP modes. The device operates over a wide supply range and has low-power consumption. Device Information(1) PART NUMBER TUSB321 2 Applications • • • • Host, Device, Dual Role Port Applications Mobile Phones Tablets and Notebooks USB Peripherals PACKAGE X2QFN (12) BODY SIZE (NOM) 1.60 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space Simplified Schematic Sample Applications ID VDD VCONN Power Rail VBUS_DET VBUS Detection CC Logic for Mode Configuration and Detection CC1 CC2 CURRENT_MODE VCONN_FAULT OUT1 Controller DIR OUT2 PORT GND Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. 1 Applications ........................................................... 1 Description ............................................................. 1 Revision History..................................................... 2 Pin Configuration and Functions ......................... 3 Specifications......................................................... 4 6.1 6.2 6.3 6.4 6.5 6.6 7 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 4 Electrical Characteristics........................................... 5 Switching Characteristics .......................................... 6 Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 9 7.3 Feature Description................................................... 9 7.4 Device Functional Modes........................................ 11 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 8.3 Initialization Set Up ................................................ 17 9 Power Supply Recommendations...................... 17 10 Layout................................................................... 17 10.1 Layout Guidelines ................................................. 17 10.2 Layout Example .................................................... 17 11 Device and Documentation Support ................. 18 11.1 11.2 11.3 11.4 11.5 Receiving Notification of Documentation Updates 18 Community Resources.......................................... 18 Trademarks ........................................................... 18 Electrostatic Discharge Caution ............................ 18 Glossary ................................................................ 18 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History Changes from Revision B (September 2016) to Revision C Page • Deleted Feature "Industrial Temperature Range of –40 to 85°C" ......................................................................................... 1 • Deleted text from the Description: "The TUSB321 device is available in industrial and commercial temperature ranges." ................................................................................................................................................................................. 1 • Changed pin VBUS_DET description From: 900-kΩ To: RVBUS in Pin Functions table. ........................................................ 3 • Changed RVBUS values From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ ........... 6 • Changed resister value From: 900 kΩ To: To: RVBUS in Figure 3........................................................................................... 8 • Changed resister value From: 900 kΩ To: To: RVBUS in Functional Block Diagram............................................................... 9 • Changed From: The system VBUS voltage must be routed through a 900-kΩ resistor to the VBUS_DET pin .. To: The system VBUS voltage must be routed through a RVBUS resistor to the VBUS_DET pin .. in the VBUS Detection ................... 11 • Added resister RVBUS in Figure 4 .......................................................................................................................................... 14 • Added row for RVBUS to Table 4 ........................................................................................................................................... 15 • Changed From: must be connected through a 900-kΩ resistor to VBUS on the Type-C... To: must be connected through a RVBUS resistor to VBUS on the Type-C .. in the Detailed Design Procedure.......................................................... 15 Changes from Revision A (June 2015) to Revision B • Changed pins CC1 and CC2 values From: MIN = –0.3 MAX = VDD + 0.3 To: MIN –0.3 MAX = 6 in the Absolute Maximum Ratings ................................................................................................................................................................... 4 Changes from Original (June 2015) to Revision A • 2 Page Page Changed device status from Product Preview to Production Data ....................................................................................... 1 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 5 Pin Configuration and Functions RWB Package 12-Pin X2QFN Top View CURRENT_MODE 3 PORT CC2 CC1 2 1 12 VDD 4 11 DIR VBUS_DET 5 10 GND VCONN_FAULT 6 9 ID 7 8 OUT1 OUT2 Pin Functions PIN TYPE DESCRIPTION NAME NO. CC1 1 I/O Type-C configuration channel signal 1 CC2 2 I/O Type-C configuration channel signal 2 Advertise VBUS current. This 3-level input is used to control current advertisement in DFP mode or DRP mode connected as source. (See Table 2.) CURRENT_MODE 3 I L - Default Current. Pull-down to GND or leave unconnected. M - Medium (1.5A) current. Pull-up to VDD with 500-kΩ resistor. H - High (3.0A) current. Pull-up to VDD with 10-kΩ resistor. Tri-level input pin to indicate port mode. The state of this pin is sampled when VDD is active. PORT 4 I H - DFP (Pull-up to VDD if DFP mode is desired) NC - DRP (Leave unconnected if DRP mode is desired) L - UFP (Pull-down or tie to GND if UFP mode is desired) VBUS_DET 5 I 5- to 28-V VBUS input voltage. VBUS detection determines UFP attachment. One RVBUS external resistor required between system VBUS and VBUS_DET pin. VCONN_FAULT 6 O Open-drain output and is asserted low for tFAULT when VCONN over-current fault is detected. (See Figure 2.) OUT1 7 I/O This pin is an open drain output for communicating Type-C current mode detect when the device is in UFP mode. Default current mode detected (H); medium or high current mode detected (L). (See Table 2.) OUT2 8 I/O This pin is an open drain output for communicating Type-C current mode detect when the device is in UFP mode: default or medium current mode detected (H); high current mode detected (L). (See Table 2.) ID 9 O Open drain output; asserted low when the CC pins detect device attachment when port is a source (DFP), or dual-role (DRP) acting as source (DFP). GND 10 G Ground DIR 11 O DIR of plug. This open drain output indicates the detected plug orientation: Type-C plug position 2 (H); Type-C plug position 1 (L). VDD 12 P Positive supply voltage Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 3 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage Control pins MIN MAX UNIT VDD –0.3 6 V PORT, CURRENT_MODE, ID, DIR, VCONN_FAULT –0.3 VDD + 0.3 CC1, CC2 –0.3 6 OUT1, OUT2 –0.3 VDD + 0.3 VBUS_DET –0.3 4 –65 150 Storage temperature, Tstg (1) V °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±7000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±1500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VDD Supply voltage range 4.5 VBUS System VBUS voltage 4 VBUS_DET VBUS_DET threshold voltage on the pin VCONN Supply for active cable (With VDD at 5 V) TA Operating free air temperature range NOM MAX UNIT 5.5 V 28 V 4 V 5 4.75 0 25 5.5 V 70 °C 6.4 Thermal Information THERMAL METRIC (1) RWB (X2QFN) UNIT 12 PINS RθJA Junction-to-ambient thermal resistance 169.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 68.1 °C/W RθJB Junction-to-board thermal resistance 83.4 °C/W ψJT Junction-to-top characterization parameter 2.2 °C/W ψJB Junction-to-board characterization parameter 83.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A — (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) TEST CONDITIONS PARAMETER MIN TYP MAX UNIT Power Consumption IUNATTACHED_UFP Current consumption in unattached mode when port is unconnected and waiting for connection. (VDD = 5 V, PORT = L) 100 µA IACTIVE_UFP Current consumption in active mode. (VDD = 5 V, PORT = L) 100 µA CC1 and CC2 Pins RCC_D Pulldown resistor when in UFP or DRP mode. 4.6 5.1 5.6 kΩ VTH_UFP_CC_USB Voltage threshold for detecting a DFP attach when configured as a UFP and DFP is advertising default current source capability. 0.15 0.2 0.25 V VTH_UFP_CC_MED Voltage threshold for detecting a DFP attach when configured as a UFP and DFP is advertising medium (1.5 A) current source capability. 0.61 0.66 0.7 V VTH_UFP_CC_HIGH Voltage threshold for detecting a DFP attach when configured as a UFP and DFP is advertising high (3 A) current source capability. 1.169 1.23 1.29 V VTH_DFP_CC_USB Voltage threshold for detecting a UFP attach when configured as a DFP and advertising default current source capability. 1.51 1.6 1.64 V VTH_DFP_CC_MED Voltage threshold for detecting a UFP attach when configured as a DFP and advertising medium current (1.5 A) source capability. 1.51 1.6 1.64 V VTH_DFP_CC_HIGH Voltage threshold for detecting a UFP attach when configured as a DFP and advertising high current (3.0 A) source capability. 2.46 2.6 2.74 V VTH_AC_CC_USB Voltage threshold for detecting a active cable attach when configured as a DFP and advertising default current source. 0.15 0.20 0.25 V VTH_AC_CC_MED Voltage threshold for detecting a active cable attach when configured as a DFP and advertising medium current (1.5 A) source. 0.35 0.40 0.45 V VTH_AC_CC_HIGH Voltage threshold for detecting a active cable attach when configured as a DFP and advertising high current (3.0 A) source. 0.76 0.80 0.84 V ICC_DEFAULT_P Default mode pullup current source when operating in DFP or DRP mode. 64 80 96 µA ICC_MED_P Medium (1.5 A) mode pullup current source when operating in DFP or DRP mode. 166 180 194 µA ICC_HIGH_P High (3 A) mode pullup current source when operating in DFP or DRP mode. (1) 304 330 356 µA 0.4 V 0.56 × VDD V Control Pins: PORT, CURRENT_MODE, VCONN_FAULT, DIR, ID, OUT1, OUT2 VIL Low-level control signal input voltage, (PORT, CURRENT_MODE) VIM Mid-level control signal input voltage (PORT, CURRENT_MODE) 0.28 × VDD VIH High-level control signal input voltage (PORT, CURRENT_MODE) VDD - 0.3 IIH High-level input current –20 20 µA IIL Low-level input current –10 10 µA Rpu Internal pullup resistance (PORT) 588 kΩ Rpd Internal pulldown resistance (PORT) 1.1 MΩ RPD_CUR Internal pulldown resistance for CURRENT_MODE pin 275 kΩ VOL Low-level signal output voltage (open-drain) (VCONN_FAULT, ID, OUT1, OUT2) Rp_ODext External pullup resistor on open drain IOs (VCONN_FAULT, ID, OUT1, OUT2) 200 kΩ Rp_TLext Tri-level input external pull-up resistor (PORT) 4.7 kΩ (1) V IOL = –1.6 mA 0.4 V VDD must be 3.5 V or greater to advertise 3 A current. Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 5 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com Electrical Characteristics (continued) over operating free-air temperature range (unless otherwise noted) TEST CONDITIONS PARAMETER MIN TYP MAX UNIT Rp_cm_med External pull-up resistor on CURRENT_MODE pin to advertise 1.5-A current 500 kΩ Rp_cm_high External pull-up resistor on CURRENT_MODE pin to advertise 3.0-A current 10 kΩ VBUS_DET IO Pins (Connected to System VBUS signal through external resistor) VBUS_THR VBUS threshold range 2.95 3.30 3.80 V RVBUS External resistor between VBUS and VBUS_DET pin 855 887 920 KΩ RVBUS_PD Internal pulldown resistance for VBUS_DET 95 KΩ DIR pin (Open Drain IO) VOL Low-level signal output voltage IOL = –1.6 mA 0.4 V VCONN RON On resistance of the VCONN power FET 1.25 Ω VTOL Voltage tolerance on VCONN power FET 5.5 V VPASS Voltage to pass through VCONN power FET 5.5 V IVCONN VCONN current limit; VCONN is disconnected above this value 200 CBULK Bulk capacitance on VCONN; placed on VDD supply 10 mA 200 µF 6.6 Switching Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP MAX UNIT tCCCB_DEFAULT Power on default of CC1 and CC2 voltage debounce time tVBUS_DB Debounce of VBUS_DET pin after valid VBUS_THR (See Figure 1.) tDRP_DUTY_CYCLE Power-on default of percentage of time DRP advertises DFP during a TDRP tDRP The period TUSB321 in DFP mode completes a DFP to UFP and back advertisement. 50 75 100 ms tFAULT VCONN_FAULT asserted low time after VCONN over-current condition is detected. (See Figure 2.) 7 10 13 µs 6 Submit Documentation Feedback 133 ms 2 ms 30% Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 VVBUS VBUS_THR tVBUS_DB 0V Time Figure 1. VBUS Detect and Debounce tFAULT VPULL-UP VVCONN_FAULT 0V Time Figure 2. VCONN_FAULT Assertion Pulse Timing Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 7 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com 7 Detailed Description 7.1 Overview The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and reversible. Because of the nature of the connector, a scheme is needed to determine the connector orientation. Additional schemes are needed to determine when a USB port is attached and the acting role of the USB port (DFP, UFP, DRP), as well as to communicate Type-C current capabilities. These schemes are implemented over the CC pins according to the USB Type-C specifications. The TUSB321 device provides Configuration Channel (CC) logic for determining USB port attach and detach, role detection, cable orientation, and Type-C current mode. The TUSB321 device also contains several features such as VCONN sourcing, USB3.1 MUX direction control, mode configuration and low standby current which make this device ideal for source or sinks in USB2.0 or USB3.1 applications. 7.1.1 Cables, Adapters, and Direct Connect Devices Type-C Specification 1.1 defines several cables, plugs and receptacles to be used to attach ports. The TUSB321 device supports all cables, receptacles, and plugs. The TUSB321 device does not support e-marking. 7.1.1.1 USB Type-C Receptacles and Plugs Below is list of Type-C receptacles and plugs supported by the TUSB321 device: • USB Type-C receptacle for USB2.0 and USB3.1 and full-featured platforms and devices • USB full-featured Type-C plug • USB2.0 Type-C plug 7.1.1.2 USB Type-C Cables Below is a list of Type-C cables types supported by the TUSB321 device: • USB full-featured Type-C cable with USB3.1 full-featured plug • USB2.0 Type-C cable with USB2.0 plug • Captive cable with either a USB full-featured plug or USB2.0 plug 7.1.1.3 Legacy Cables and Adapters The TUSB321 device supports legacy cable adapters as defined by the Type-C Specification. The cable adapter must correspond to the mode configuration of the TUSB321 device. To system VBUS detection Legacy Host Adapter TUSB321 RVBUS RP 56 k: ±5% CC VBUS_DET CC RD 5.1 k: ±10% Figure 3. Legacy Adapter Implementation Circuit 7.1.1.4 Direct Connect Devices The TUSB321 device supports the attaching and detaching of a direct-connect device. 8 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 7.2 Functional Block Diagram VDD CURRENT_MODE PORT DIR_CTRL DIR Logic DIR CTRL Tri-State Buffer CC1 Digital Controller Connection and Cable Detection VBUS_ON CRTL_INT CRTL_ID CRTL_EN_N VBUS Detection CC2 CRTL_ID CRTL_EN_N VBUS_ON VBUS_DET CTRL Open Drain Output OUT1 OUT2 ID VCONN_FAULT GND RVBUS SYS_VBUS 7.3 Feature Description 7.3.1 Port Role Configuration The TUSB321 device can be configured as a downstream facing port (DFP), upstream facing port (UFP), or dualrole port (DRP) using the tri-level PORT pin. The PORT pin should be pulled high to VDD using a pullup resistance, low to GND or left as floated on the PCB to achieve the desired mode. This flexibility allows the TUSB321 device to be used in a variety of applications. The TUSB321 device samples the PORT pin after reset and maintains the desired mode until the TUSB321 device is reset again. Table 1 lists the supported features in each mode: Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 9 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com Feature Description (continued) Table 1. Supported Features for the v Device by Mode PORT PIN HIGH (DFP ONLY) LOW (UFP ONLY) NC (DRP) Port attach and detach Yes Yes Yes Cable orientation Yes Yes Yes Current advertisement Yes - Yes (DFP) SUPPORTED FEATURES Current detection - Yes Yes (UFP) Active cable detection Yes - Yes (DFP) VCONN Yes - Yes (DFP) Legacy cables Yes Yes Yes VBUS detection - Yes Yes (UFP) 7.3.1.1 Downstream Facing Port (DFP) - Source The TUSB321 device can be configured as a DFP only by pulling the PORT pin high through a resistance to VDD. In DFP mode, the TUSB321 device constantly presents Rps on both CC. In DFP mode, the TUSB321 device advertises USB Type-C current based on the state of the CURRENT_MODE pin. When configured as a DFP, the TUSB321 can operate with older USB Type-C 1.0 devices except for a USB Type-C 1.0 DRP device. The TUSB321 can not operate with a USB Type-C 1.0 DRP device. This limitation is a result of backwards compatibility problem between USB Type-C 1.1 DFP and a USB Type-C 1.0 DRP. 7.3.1.2 Upstream Facing Port (UFP) - Sink The TUSB321 device can be configured as a UFP only by pulling the PORT pin low to GND. In UFP mode, the TUSB321 device constantly presents pulldown resistors (Rd) on both CC pins. The TUSB321 device monitors the CC pins for the voltage level corresponding to the Type-C mode current advertisement by the connected DFP. The TUSB321 device debounces the CC pins and wait for VBUS detection before successfully attaching. As a UFP, the TUSB321 device detects and communicates the advertised current level of the DFP to the system through the OUT1 and OUT2 pins. 7.3.1.3 Dual Role Port (DRP) The TUSB321 device can be configured to operate as a DRP when the PORT pin is left floated on the PCB. In DRP mode, the TUSB321 device toggles between operating as a DFP and a UFP. When functioning as a DFP in DRP mode, the TUSB321 device complies with all operations as defined for a DFP according to the Type-C Specification. When presenting as a UFP in DRP mode, the TUSB321 device operates as defined for a UFP according to the Type-C Specification. 7.3.2 Type-C Current Mode The TUSB321 device supports both advertising and detection of Type-C current. When TUSB321 is a UFP or a DRP connected as a sink, the OUT1 and OUT2 pins are used to inform the system the detected USB Type-C current being broadcasted by the attached DFP. When TUSB321 device is a DFP or a DRP connected as a source, the CURRENT_MODE pin is used to advertise the USB Type-C current. The current advertisement for the TUSB321 device is 500 mA (for USB2.0) or 900 mA (for USB3.1) if CURRENT_MODE pin is left unconnected or pulled to GND. If a higher level of current is required, the CURRENT_MODE can be pulled up to VDD through a 500-kΩ resistor to advertise medium current at 1.5 A or pulled up to VDD through a 10-kΩ resistor to advertise high current at 3 A. Table 2 lists the Type-C current advertisements and detection. 10 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 Table 2. Type-C Current Advertisement and Detection UFP or DRP acting as UFP Current Detection DFP or DRP acting as DFP Current Advertisement OUT1 = High OUT2 = High (unattached) or Low (attached) CURRENT_MODE = L Medium - 1.5 A OUT1 = Low OUT2 = High CURRENT_MODE = M High - 3 A OUT1 = Low OUT2 = Low CURRENT_MODE = H TYPE-C CURRENT Default 500 mA (USB2.0) 900 mA (USB3.1) 7.3.3 VBUS Detection The TUSB321 device supports VBUS detection according to the Type-C Specification. VBUS detection is used to determine the attachment and detachment of a UFP. VBUS detection is also used to successfully resolve the role in DRP mode. The system VBUS voltage must be routed through a RVBUS resistor to the VBUS_DET pin on the TUSB321 device if the PORT pin is configured as a DRP or a UFP. If the TUSB321 device is configured as a DFP and only ever used in DFP mode, the VBUS_DET pin can be left unconnected. 7.3.4 Cable Orientation and External MUX Control The TUSB321 device has the ability to control an external/discrete MUX using the DIR pin. The TUSB321 detects the cable orientation by monitoring the voltage on the CC pins. When a voltage level within the proper threshold is detected on CC1, the DIR pin is pulled low. When a voltage level within the proper threshold is detected on CC2, the DIR is pulled high. If the direction polarity of the external MUX is opposite of the TUSB321, the TUSB321 CC1/CC2 connection to USB Type-C receptacle can be reversed. The DIR pin is an open drain output. 7.3.5 VCONN Support for Active Cables The TUSB321 device supplies VCONN to active cables when configured in DFP mode or in DRP acting as a DFP mode. VCONN is provided only when the unconnected CC pin is terminated to a resistance, Ra, and after a UFP is detected and the Attached.SRC state is entered. When in DFP mode or in DRP acting as a DFP mode, a 5-V source must be connected to the VDD pin of the TUSB321 device after Attached.SRC. VCONN is supplied from VDD through a low resistance power FET out to the unconnected CC pin. VCONN is removed when a detach event is detected and the active cable is removed. 7.4 Device Functional Modes The TUSB321 device has two functional modes. Table 3 lists these modes: Table 3. USB Type-C States According to TUSB321 Functional Modes MODES GENERAL BEHAVIOR PORT PIN UFP Unattached USB port unattached. ID, PORT operational. CC pins configure according to PORT pin. DRP DFP UFP Active USB port attached. All GPIOs operational. DRP DFP (1) STATES (1) Unattached.SNK AttachWait.SNK Toggle Unattached.SNK → Unattached.SRC AttachedWait.SRC or AttachedWait.SNK Unattached.SRC AttachWait.SRC Attached.SNK Attached.SNK Attached.SRC Attached.SRC Required; not in sequential order. Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 11 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com 7.4.1 Unattached Mode Unattached mode is the primary mode of operation for the TUSB321 device, because a USB port can be unattached for a lengthy period of time. In unattached mode, VDD is available, and all IOs are operational. After the TUSB321 device is powered up, the part enters unattached mode until a successful attach has been determined. Initially, right after power up, the TUSB321 device comes up as an Unattached.SNK. The TUSB321 device checks the PORT pin and operates according to the mode configuration. The TUSB321 device toggles between the UFP and the DFP if configured as a DRP. The PORT pin is only sampled at reset or power up. 7.4.2 Active Mode Active mode is defined as the port being attached. In active mode, all GPIOs are operational. When in active mode, the TUSB321 device communicates to the AP that the USB port is attached. This happens through the ID pin if TUSB321 is configured as a DFP or DRP connect as source. If TUSB321 is configured as a UFP or a DRP connected as a sink, the OUT1 and OUT2 pins are used. The TUSB321 device exits active mode under the following conditions: • Cable unplug • VBUS removal if attached as a UFP 12 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TUSB321 device is a Type-C configuration channel logic and port controller. The TUSB321 device can detect when a Type-C device is attached, what type of device is attached, the orientation of the cable, and power capabilities (both detection and broadcast). The TUSB321 device can be used in a source application (DFP) or in a sink application (UFP). 8.2 Typical Application 8.2.1 DFP Mode Figure 4 shows the TUSB321 device configured as a DFP. Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 13 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com Typical Application (continued) DM DP USB VBUS Switch System VBUS VIN PS_EN EN PS_FAULT VOUT FAULT VDD_5V VCC_3.3V 150 µF 100 µF DM DP 100 nF VBUS RXP2 VBUS_DET RXN2 PORT USB3 Host and PMIC CURRENT_MODE CC2 TUSB321 ID ID CC1 CC1 CC2 VCONN_FAULT FAULT 100 nF DIR GND TXN1 TXP1 A12 B1 A11 B2 A10 B3 A9 A8 B4 B5 A7 B6 A6 B7 A5 B8 A4 A3 B9 B10 A2 B11 A1 B12 TXP2 TXN2 Type C RVBUS 4.7 kW Receptacle 10 kW VDD 200 kW 200 kW RXN1 RXP1 VCC_3.3V VCC_3.3V 10 kW VCC SEL 100 nF TXP2 B0P TXN2 B0N A1P SSRXN A1N OEN HD3SS3212 SSRXP 100 nF RXP2 RXN2 B1P B1N 100 nF TXN1 TXP1 C0P C0N RXN1 RXP1 C1P C1N GND SSTXN A0P A0N SSTXP Figure 4. DFP Mode Schematic 14 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 Typical Application (continued) 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 4: Table 4. Design Requirements for DFP Mode DESIGN PARAMETER VALUE VDD (4.5 V to 5.5 V) 5V Type-C port type (UFP, DFP, or DRP) DFP PORT pin is pulled up Advertised Type-C Current (Default, 1.5 A, 3.0 A) 3.0 A RVBUS (855-kΩ to 920-kΩ) 900-kΩ VCONN Support Yes 8.2.1.2 Detailed Design Procedure The TUSB321 device supports a VDD in the range of 4.5 to 5.5 V. In this particular case, VDD is set to 5 V. A 100nF capacitor is placed near VDD. Also, a 100 µF is used to meet the USB Type-C bulk capacitance requirement of 10 µF to 220 µF. The TUSB321 current advertisement is determined by the state of the CURRENT_MODE pin. In this particular example, 3.0 A advertisement is desired so the CURRENT_MODE pin is pulled high to VDD through 10-kΩ resistor. The DIR pin is used to control the MUX for connecting the USB3 SS signals to the appropriate pins on the USB Type-C receptacle. In this particular case, a HD3SS3212 is used as the MUX. In order to minimize crossing in routing the USB3 SS signals to the USB Type C connector, the connection of CC1 and CC2 to the TUSB321 is swapped. The Type-C port mode is determined by the state of the PORT pin. When the PORT pin is pulled high, the TUSB321 device is in DFP mode. The VBUS_DET pin must be connected through a RVBUS resistor to VBUS on the Type-C that is connected. This large resistor is required to protect the TUSB321 device from large VBUS voltage that is possible in present day systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB321 device in the recommended range. The USB2 specification requires the bulk capacitance on VBUS based on UFP or DFP. When operating the TUSB321 device in a DFP mode, a bulk capacitance of at least 120 µF is required. In this particular case, a 150µF capacitor was chosen. Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 15 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com 8.2.1.3 Application Curve Figure 5. Application Curve for DFP Mode 16 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 TUSB321 www.ti.com SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 8.3 Initialization Set Up The general power-up sequence for the TUSB321 device is as follows: 1. System is powered off (device has no VDD). The TUSB321 device is configured internally in UFP mode with Rds on CC pins. 2. VDD ramps – POR circuit. 3. The TUSB321 device enters unattached mode and determines the voltage level from the PORT pin. This determines the mode in which the TUSB321 device operates (DFP, UFP, DRP). 4. The TUSB321 device monitors the CC pins as a DFP and VBUS for attach as a UFP. 5. The TUSB321 device enters active mode when attach has been successfully detected. 9 Power Supply Recommendations The TUSB321 device has a wide power supply range from 4.5 to 5.5 V. The TUSB321 device can be run off of a system power such as a battery. 10 Layout 10.1 Layout Guidelines 1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6 to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that: – A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm. – A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm. 2. A 100-nF capacitor should be placed as close as possible to the TUSB321 VDD pin. 10.2 Layout Example Figure 6. TUSB321 Layout Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 17 TUSB321 SLLSEO6C – JUNE 2015 – REVISED AUGUST 2018 www.ti.com 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. USB Type-C is a trademark of USB Implementers Forum. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Product Folder Links: TUSB321 PACKAGE OPTION ADDENDUM www.ti.com 10-Nov-2025 PACKAGING INFORMATION Orderable part number (1) Status Material type (1) (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material MSL rating/ Peak reflow (4) (5) Op temp (°C) Part marking (6) TUSB321RWBR Active Production X2QFN (RWB) | 12 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR 0 to 70 21 TUSB321RWBR.A Active Production X2QFN (RWB) | 12 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR 0 to 70 21 TUSB321RWBRG4 Active Production X2QFN (RWB) | 12 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 21 TUSB321RWBRG4.A Active Production X2QFN (RWB) | 12 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 21 Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be a